EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR,申请号JP19960284770-传众专利搜索

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发明名称	EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要
申请公布号	JPH10130373(A)	申请公布日期	1998.05.19
申请号	JP19960284770	申请日期	1996.10.28
申请人	SUMITOMO BAKELITE CO LTD	发明人	HOSHIKA NORIHISA
分类号	C08L63/00;C08G59/20;C08G59/62;H01L23/29;H01L23/31;(IPC1-7):C08G59/62	主分类号	C08L63/00
代理机构		代理人
主权项
地址

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