发明名称 MANUFACTURE OF CERAMIC MULTILAYER CIRCUIT AND THE CIRCUIT THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent corrosion of external conductor path and external contact connecting section by providing an external conductor path and external contact connection section composed of silver on the external surface of a sheet laminating body during or after the sintering process and then providing a metal protection film to the external conductor path and external contact connecting section. SOLUTION: A through-contact hole 1 is punched on the unbaked ceramic sheet and the through-contact hole 1 is filled with conductive paste such as silver paste. Next, a conductive path 2 consisting of a conductive material such as pure silver is printed on the ceramic sheet. Moreover, a laminated body 3 is formed by stacking the ceramic sheet and is then coupled in the pressing process. In addition, during or after the sintering process, an external conductive path 4 and external contact connecting section 5 consisting of silver are formed without formation of the intermediate conductive path 6. A metal protection film such as a nickel film or a gold film is formed on the external conductive path 4 and external contact connecting section 5 with an electrolytic plating process.
申请公布号 JPH10145042(A) 申请公布日期 1998.05.29
申请号 JP19970305764 申请日期 1997.11.07
申请人 ROBERT BOSCH GMBH 发明人 BECK WALTER;WALTER RETHLINGSHOEFER;NITSCHE DETLEF
分类号 H05K3/46;H01L21/48;H01L23/498;H05K3/24;(IPC1-7):H05K3/46 主分类号 H05K3/46
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