| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction board and method for manufacturing at a high yield, being easy to form an solder to an electronic component, etc. SOLUTION: A junction board 10 comprises a junction board main body 11, which when provided with first and second main surfaces 11A and 11B, comprises a through-hole 11H penetrating between the two surfaces, a recessed conductor 12 comprising a bottom part 12T which stops the opening on the side of second main surface 11B of the through-hole 11H and a side part 12S covering the inner peripheral surface of the through-hole 11H, and a packing solder body 13, which when packed in a recessed part 12R of the recessed conductor 12, protrudes on the side of first main surface 11A. With a bottomed recessed conductor 12 comprising the bottom part 12T and the side part 12S provided, a part of or all of solder paste which is to be a packing solder body 13 will not fall off in screen printing, etc., enhancing connectivity to the terminal of electric component, etc.
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