| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket that facilitates mounting of an IC mounting board and a contact pin assembly unit on the housing. SOLUTION: The IC socket is equipped with a semiconductor mounting board 11 which is provided with a contact guide 11b corresponding to the external electrode of the semiconductor element, a contact pin assembly unit 12 in which lead frames 15 composed of a contact pin 15a, a lead portion 15c and an external connecting terminal 15 b are provided in a matrix in a large quantity and the top end of the contact pins contacts the external electrode of the semiconductor element mounted on the semiconductor mounting board by penetrating the contact guide, a housing 13 which houses the contact pin assembly unit and the semiconductor mounting board, and a spring 14 which is provided between the semiconductor mounting board and the housing and pushes up the semiconductor mounting board. The housing portion 13b of the housing for housing the contact pin assembly unit is made to be a size in which the maximum outside portion of the contact pin assembly unit can be inserted.
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