| 摘要 |
PROBLEM TO BE SOLVED: To join a planar workpiece like a semiconductor wafer (8) to one side of a holding tool (2) without restraining air bubbles and to detach the workpiece part from the holding tool (2) without generating excessive stress in the workpiece, by improving the holding tool (2) itself and a workpiece joining and detaching method to/from the holding tool (2). SOLUTION: This holding tool (2) is formed of synthetic resin which becomes a rubber state when heated to above a glass transfer temperature and becomes a glass state when cooled to below the glass transfer temperature. When the workpiece is joined and detached to/from the holding tool (2), the holding tool (2) is heated to above the glass transfer temperature to make the tool (2) into the rubber state. |
