ELECTRONIC COMPONENT MANUFACTURING METHOD

摘要

An electronic component manufacturing method in which few voids in the resin encapsulation portion are produced, degradation of the characteristics hardly occurs, and the cost can be reduced. The method includes a reduced-pressure packing step in which SAW devices (2) mounted on a mounting assembly board (11) and a resin film (12) are placed in a bag having gas-barrier capability (13) and the bag is sealed. The method further includes an encapsulating step in which the resin film (12) is made to enter the spaces among the SAW devices (2) mounted on the reduced-pressure-packed mounting assembly board (11) by using the pressure difference between the inside and outside of the bag (13), and thereby the SAW devices (2) are encapsulated with an encapsulating resin portion (4) derived from the resin film (12).