ELECTRONIC COMPONENT MANUFACTURING METHOD

摘要

An electronic component manufacturing method wherein troubles due to outgassing from a sacrificial layer and residuals after sacrificial layer removal are prevented. The electronic component manufacturing method has a first step of forming on a substrate (12) the sacrificial layer which has polyamide-imide as a main component, a second step of forming an element section on a part of the sacrificial layer, and a third step of forming a space (11) between the element section and the substrate (12).