发明名称 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To prevent cracks from extending into a product area and a product from being failed when cut to a multiple piece printed wiring board from a panel which manufactures a plurality of printed wiring boards in bulk.SOLUTION: A multiple piece printed wiring board 100 includes: a product area 20 composed of a plurality of printed wiring boards; and a dummy area 10 formed around one or two or more product areas 20. On an outer peripheral end edge side of the dummy area 10, a dummy pattern 11 is formed, and a dummy post or a dummy wall 12 is formed while connected only to a part of the dummy pattern 11.SELECTED DRAWING: Figure 1B
申请公布号 JP2016143726(A) 申请公布日期 2016.08.08
申请号 JP20150017472 申请日期 2015.01.30
申请人 IBIDEN CO LTD 发明人 SAKAI SHUNSUKE;FURUYA TOSHIKI;NAKAMURA WATARU;ADACHI TAKEMA
分类号 H05K1/02;H05K1/11;H05K3/40 主分类号 H05K1/02
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