| 摘要 |
PURPOSE:To improve heat dissipation from a semiconductor pellet by a method wherein the semiconductor pellet which is mounted on a pellet mounting substrate made of resin with low thermal conductivity is covered with elastic material containing diamond powder or borazon powder. CONSTITUTION:A space defined by a substrate 1 and dams 7 is filled with silicone gel (elastic material) 9 which covers a pellet 3. The protruded part 10a of a cap 10 which is made of aluminum and bonded to the top surfaces of the dams 7 with adhesive 8a is contacted with the silicone gel 9. Diamond powder 11 is contained in the elastic material 9 as filler. As movement of phonons induced by lattice vibration can be realized easily in diamond owing to the regulality of crystal lattice, equality of masses of atoms forming the lattice and so forth, the diamond powder provides excellent thermal conductivity. With this constitution, the heat generated in the pellet can be transmitted quickly through the elastic material to the member contacted with the elastic material so that heat dissipation of the semiconductor device can be improved. |
