| 摘要 |
<p>PURPOSE:To prevent occurrence of halo phenomena, and to obtain a circuit board for an inner layer useful for a multilayer laminated board having no inner layer peeling by oxidizing a copper circuit arranged on the circuit board, removing an oxide film, washing it, and then drying it at a special temperature range. CONSTITUTION:When a printed wiring board for an inner layer of a multilayer laminated board used for a printed circuit board is manufactured, drying after oxidizing and removing of oxide film for a copper circuit of the board for the inner layer of the laminated board is conducted at 100-110 deg.C desirably for about 20-60min. Thus, there is no fear of dissolving the oxide film in the acid in case of plating, etc., to prevent occurrence of halo phenomena.</p> |
