| 摘要 |
PURPOSE: A wafer mapping apparatus is provided to reduce the cost and process time by repeatedly using magnetic tapes and removing bar code printing and attaching process. CONSTITUTION: A magnetic tape(3) is attached to a wafer fixing device(1). A wafer specifying device(10) identifies the wafer and records the information on the attached magnetic tape(3). A wafer matching device(20) receives the wafer's mapping data and performs die bonding process if the wafer is confirmed to be identical. Because the magnetic tape(3) attached to the wafer frame(1) is used repeatedly, it gives a cost reduction effect. Also, process time is reduced by removing bar code printing and attaching process.
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