SILANE BASED COMPOUND, METHOD FOR PREPARING THE SAME, AND COPPER FOIL SURFACE TREATMENT AGENT COMPOSITION COMPRISING THE SAME

摘要

PURPOSE: A composition of copper foil surface treating agent containing a novel silane compound is provided to improve adhesive force between a substrate and copper foil and produce a print circuit substrate having improved adhesiveness. CONSTITUTION: A novel silane compound is denoted by chemical formulas 1 to 4. In chemical formulas 1 to 4, R1, R2, and R3 is independently C1-C3 alkyl group and R4 and R5 are independently hydrogen or C1-C5 alkyl group. A composition of copper foil surface treating agent contains one compound selected from silane compounds of chemical formulas 1-4 and solvent. The solvent is water, methanol, ethanol, or their mixture. The silane compound is prepared by reacting succinic anhydride, 2,3-pyridinedicarboxylic anhydride or benzenetricarboxylic anhydride at 10°C-100°C.