发明名称 SUBSTRATE TREATING APPARATUS AND METHOD
摘要 The present invention relates to a substrate processing device comprising: a housing which provides a space for processing a substrate therein; a spin head which supports and rotates the substrate inside the housing; and a spray unit which includes a first nozzle member spraying a first processing solution to the substrate positioned on the spin head. The first nozzle member comprises: a body which includes a spray flow path in which the first processing solution flows, and a first outlet which communicates with the spray flow path and sprays the first processing solution to the substrate; a vibrator which is installed inside the body, and vibrates the first processing solution flowing in the spray flow path; a processing solution supplying line which includes a first valve supplying the first processing solution to the body; and a pressure controlling member which connects a front end and a back end of the first valve, and monitors pressure of the processing solution supplying line by measuring pressure difference between the front end and the back end.
申请公布号 KR20160083308(A) 申请公布日期 2016.07.12
申请号 KR20140194002 申请日期 2014.12.30
申请人 SEMES CO., LTD. 发明人 JU, YOON JONG;CHOI, KI HOON;OH, SE HOON
分类号 H01L21/302;H01L21/02 主分类号 H01L21/302
代理机构 代理人
主权项
地址
您可能感兴趣的专利