发明名称 |
Acoustic wave device |
摘要 |
An acoustic wave device includes: a chip; an acoustic wave element formed on a principal surface of the chip; a first pad formed on the principal surface of the chip and electrically connected to the acoustic wave element; a substrate having a principal surface facing the principal surface of the chip; a second pad formed on the principal surface of the substrate; a first bump formed between the first pad and the second pad and electrically connecting the first pad and the second pad; and a second bump formed between the chip and the substrate and making direct contact with the substrate. |
申请公布号 |
US9407235(B2) |
申请公布日期 |
2016.08.02 |
申请号 |
US201414303158 |
申请日期 |
2014.06.12 |
申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
Yamashita Takashi |
分类号 |
H03H9/64;H03H9/54;H03H9/05;H03H9/10 |
主分类号 |
H03H9/64 |
代理机构 |
Chen Yoshimura LLP |
代理人 |
Chen Yoshimura LLP |
主权项 |
1. An acoustic wave device comprising:
a chip; an acoustic wave element formed on a principal surface of the chip; a first pad formed on the principal surface of the chip and electrically connected to the acoustic wave element; a substrate having a principal surface facing the principal surface of the chip; a second pad formed on the principal surface of the substrate; a first bump formed between the first pad and the second pad and electrically connecting the first pad and the second pad; and a second bump formed between the chip and the substrate and making direct contact with the substrate, wherein a width of the second bump is less than a width of the first bump. |
地址 |
Tokyo JP |