| 摘要 |
A PBGA-type semiconductor device is comprised such that a semiconductor chip is fixedly attached to the front surface of a resin substrate thereof with the use of an adhesive composed mainly of a resin material. As both the resin substrate and the adhesive are composed mainly of resin materials, adhesion therebetween is excellent, and risk of exfoliation of the semiconductor chip from the resin substrate is eliminated owing to strong bonding therebetween. Furthermore, power-source related connection electrodes are formed so as to be extended to a region where the semiconductor chip is fixedly attached onto the front surface of the resin substrate while an electrically conductive adhesive is used as the adhesive. As a result, the body of the semiconductor chip and the power-source related connection electrodes are rendered to be equal in potential while heat generated in the semiconductor chip can be radiated via the electrically conductive adhesive and the power-source related connection electrodes. |
