发明名称 |
Thermal processing apparatus |
摘要 |
<p>A thermal processing apparatus includes a reaction vessel into which an object to be processed is conveyed, a furnace body disposed so as to surround the reaction vessel, and a heater disposed in a region surrounding the reaction vessel in the furnace body. The heater includes heating elements, each having a sealing member made of a ceramic material and a linear flexible resistance heat generating member sealed by the sealing member.</p> |
申请公布号 |
EP1132506(A1) |
申请公布日期 |
2001.09.12 |
申请号 |
EP20010101823 |
申请日期 |
2001.01.26 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
TAKANORI, SAITO;TSUYOSHI, TAKIZAWA;KENICHI, YAMAGA |
分类号 |
C30B31/12;F27B17/00;F27B5/14;F27D1/10;F27D1/12;F27D11/02;H01L21/22;H01L21/31;H05B3/62;(IPC1-7):C30B31/12 |
主分类号 |
C30B31/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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