| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor device and the manufacturing method of a semiconductor device mounted assembly that reduce the time required for mounting the semiconductor device onto a board, and improve productivity in the mounting method of the semiconductor device and the manufacturing method of the semiconductor device mounted assembly that allow the semiconductor device to be subjected to flip-chip connection. SOLUTION: A first insulating resin layer is formed on the surface of the board having a pad to be connected to the salient electrode of the semiconductor device, and a position is fitted to the pad on the board where the first insulating resin layer is formed for electrically connecting the salient electrode of the semiconductor device. In addition, a second insulating resin layer for covering the semiconductor device is formed on the board where the semiconductor device is electrically connected to heat the second insulating resin layer, and at the same time the first insulating resin layer is cured. |
