| 摘要 |
A semiconductor power module ( 1 ) comprises at least a substrate ( 2 ) including at least a semiconductor element ( 6, 7, 8 ) and a pressing device ( 40 ) which acts on the substrate ( 2 ). The pressing device ( 40 ) enables to press the substrate ( 2 ), when mounted, on a cooling element ( 30 ) so as to evacuate from semiconductor components operational heat losses. The pressing device ( 40 ) consists of a housing ( 10 ) provided with at least an elastic deformation zone ( 16, 17, 15, 18, 19 ).
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