发明名称 Grinding wheel design with elongated teeth arrangement
摘要 A grinding wheel includes a base disk, and a plurality of teeth protruding beyond a surface of the base disk. The plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel.
申请公布号 US9358660(B2) 申请公布日期 2016.06.07
申请号 US201514724916 申请日期 2015.05.29
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Su Chun-Hsing;Lin Jing-Cheng;Fu Tsei-Chung;Chang Wen-Hua;Mao Yi-Chao
分类号 B24B37/16;B24B7/22;B24B37/013;B24B49/12;H01L21/67;B24B49/10;H01L21/66;H01L23/00;H01L21/683;H01L23/31;H01L23/538 主分类号 B24B37/16
代理机构 Slater Matsil, LLP 代理人 Slater Matsil, LLP
主权项 1. An apparatus for grinding a wafer, the apparatus comprising: a grinding wheel configured to rotate around a first axis, the grinding wheel comprising: a base disk; anda plurality of teeth protruding beyond a surface of the base disk, wherein the plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel; and a turntable configured to rotate around a second axis misaligned from the first axis; and a chuck over the turntable and configured to rotate along with the turntable, wherein the grinding wheel faces a portion of the chuck, wherein the plurality of teeth is configured so that when a tooth having a minimum distance from the first axis passes through a connecting line pointing from the first axis to the second axis, the tooth overlaps the second axis, and the minimum distance is equal to or greater than a distance between the first axis and the second axis.
地址 Hsin-Chu TW
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