发明名称 |
Grinding wheel design with elongated teeth arrangement |
摘要 |
A grinding wheel includes a base disk, and a plurality of teeth protruding beyond a surface of the base disk. The plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel. |
申请公布号 |
US9358660(B2) |
申请公布日期 |
2016.06.07 |
申请号 |
US201514724916 |
申请日期 |
2015.05.29 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Su Chun-Hsing;Lin Jing-Cheng;Fu Tsei-Chung;Chang Wen-Hua;Mao Yi-Chao |
分类号 |
B24B37/16;B24B7/22;B24B37/013;B24B49/12;H01L21/67;B24B49/10;H01L21/66;H01L23/00;H01L21/683;H01L23/31;H01L23/538 |
主分类号 |
B24B37/16 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. An apparatus for grinding a wafer, the apparatus comprising:
a grinding wheel configured to rotate around a first axis, the grinding wheel comprising:
a base disk; anda plurality of teeth protruding beyond a surface of the base disk, wherein the plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel; and a turntable configured to rotate around a second axis misaligned from the first axis; and a chuck over the turntable and configured to rotate along with the turntable, wherein the grinding wheel faces a portion of the chuck, wherein the plurality of teeth is configured so that when a tooth having a minimum distance from the first axis passes through a connecting line pointing from the first axis to the second axis, the tooth overlaps the second axis, and the minimum distance is equal to or greater than a distance between the first axis and the second axis. |
地址 |
Hsin-Chu TW |