Method for Producing a Conversion Lamina and Conversion Lamina

摘要

A method for producing at least one conversion lamina for a radiation-emitting semiconductor component is specified. A base material including a conversion substance contained therein is applied to a substrate by means of a double-layered stencil. Furthermore, a conversion lamina for a radiation-emitting semiconductor component includes a base material and a conversion substance embedded therein. The thickness of the conversion lamina is in a range of between 60 μm and 170 μm inclusive.

主权项

1. A conversion lamina for a radiation-emitting semiconductor component, the conversion lamina comprising:
a base material; and a conversion substance embedded in the base material, wherein the conversion lamina has a thickness that lies in a range between 60 μm inclusive and 170 μm inclusive.