GOLD ELECTROPLATING SOLUTION AND METHOD

摘要

A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.

主权项

1. A gold electroplating solution comprising:
a gold (III) cyanide compound, the gold (III) cyanide compound being at least one of potassium gold (III) cyanide, ammonium gold (III) cyanide, and sodium gold (III) cyanide; a chloride compound, the chloride compound being at least one of potassium chloride, ammonium chloride, and sodium chloride; and hydrochloric acid.