Randmontierte Packung vom Oberflächen-Montierungstyp, für integrierte Halbleiterschaltungsanordnungen
摘要
<p>A flat package (10) for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic (12) containing a semiconductor chip (11), and flat leads (14) extend from one edge of the package. The leads are bent to provide an area (18) to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs (15) extending from the edge of the package adjacent the leads. The studs have stops (17) formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.</p>
申请公布号
DE68928320(T2)
申请公布日期
1998.01.29
申请号
DE1989628320T
申请日期
1989.03.08
申请人
TEXAS INSTRUMENTS INC., DALLAS, TEX., US
发明人
BAUDOUIN, DANIEL A., MISSOURI CITY, TX 77659, US;RUSSELL, ERNEST J., RICHMOND, TX 77469, US