发明名称 |
Mounting SMD components on circuit board, e.g. for acceleration sensor used in passenger protection system by using SMD contact surface and contact zone of different areas |
摘要 |
<p>The placing surfaces of the SMD contacts (3,5) of a surface mounted device (1) are connected to associated contact zones of a circuit board using solder. The placing surface of at least one SMD contact and the corresponding contact zone have different areas relative to each other. During the SMD solder process, the SMD contact(s) float on the solder so that a central alignment is achieved between the placing surfaces of the SMD contacts and the contact zones of the circuit board. The use of the method to mount an acceleration sensor for a passenger protection system in a motor vehicle is also claimed.</p> |
申请公布号 |
DE19909643(A1) |
申请公布日期 |
2000.05.04 |
申请号 |
DE1999109643 |
申请日期 |
1999.03.05 |
申请人 |
DAIMLERCHRYSLER AG |
发明人 |
BAUR, RICHARD;FENDT, GUENTER;FINKENZELLER, JOHANN;SCHLINGMANN, RALF |
分类号 |
H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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