MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To surely mount an electronic component on a circuit board via anisotropic conduction adhesive. SOLUTION: In a mounting structure, plural circuit conductors 2 are installed on the upper face of a substrate 1, and insulators 3 higher than the circuit conductors 2 are installed between the conductors. Plural terminal electrodes 6 installed below a mounted electronic component 4 are connected to the circuit conductors 2 via conductive fine particles 9, existing in anisotropic conduction adhesive 7 higher than the circuit conductors 2. The upper face of the insulators 3 are made into convex curve forms.