| 摘要 |
<p>A sensor element is provided with a sensor substrate and a sensing portion supported by the substrate, wherein a resin film is formed between the sensor substrate and the sensing member. The resin film has heat resistance against manufacturing process temperatures and use temperatures and excellent coverage of the underlying surface having a three-dimensional structure. The surface can be planarized. The stress on the sensing portion is little. The resin film can be formed at a low temperature, which prevents bad influence on the sensing portion during the manufacturing process.</p> |
