发明名称 ELECTRONIC COMPONENT AND ITS PRODUCTION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which can avoid electrical disconnection between a wiring in the inside of a substrate and a conductor formed on the substrate surface and can be baked at a low temperature. SOLUTION: The electronic component has a first insulating layer, a second insulating layer and an external connection electrode. The first insulating layer is plural and constitutes a substrate with an inner conductor inside, each of which is a composite composition containing a ceramic component and a glass component. The second insulating layer contains resin and is provided on the first insulating layer. The external connection electrode is provided on the second insulating layer and constitutes a wiring conductor connected to the inner conductor. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008227515(A) 申请公布日期 2008.09.25
申请号 JP20080092661 申请日期 2008.03.31
申请人 TDK CORP 发明人 HAYASHI KATSUHIKO
分类号 H01F27/00;H01G4/40;H05K3/46 主分类号 H01F27/00
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