VERBESSERUNGEN BEI ODER IM ZUSAMMENHANG MIT LÖTMITTELN
摘要
<p>A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.</p>
申请公布号
DE602005011848(D1)
申请公布日期
2009.01.29
申请号
DE20056011848T
申请日期
2005.08.26
申请人
QUANTUM CHEMICAL TECHNOLOGIES (S'PORE) PTE LTD.;SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE.LTD.
