| 发明名称 |
ORGANIC-INORGANIC HYBRID STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES |
| 摘要 |
An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes. |
| 申请公布号 |
US2016181169(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414581575 |
申请日期 |
2014.12.23 |
| 申请人 |
INTEL CORPORATION |
发明人 |
HUANG PLORY;Su Henry;Chung Chee Key;Ong Ryan;Wang Jones;Hsieh Daniel |
| 分类号 |
H01L23/13;H01L23/00 |
主分类号 |
H01L23/13 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit package comprising:
a ceramic frame having a top side and a bottom side, the to side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor; an integrated circuit die attached to the bottom floor over the conductive through holes; and a redistribution layer on the bottom side connected to the conductive through holes. |
| 地址 |
Santa Clara CA US |
