发明名称 LAYERED BODY WITH SUPPORT SUBSTRATE, METHOD FOR FABRICATING SAME, AND METHOD FOR FABRICATING MULTI-LAYER WIRING SUBSTRATE
摘要 A layered body with a support substrate, the layered body being on the support substrate and comprising: metal foil B which is arranged on the support substrate and on which a wiring pattern is not formed; an insulating layer B which is arranged on the metal foil B; metal foil C which is arranged on the insulating layer B and on which a wiring pattern is not formed; non-through holes for a product and non-through holes for an alignment mark that penetrate the metal foil C and the insulating layer B and reach the metal foil B; and the alignment mark of a dot pattern in which the non-through holes for the alignment mark are filled by plating and gathered and arranged in an individually independent state.
申请公布号 US2016198564(A1) 申请公布日期 2016.07.07
申请号 US201314655472 申请日期 2013.12.27
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 HATAZAWA Hiroki
分类号 H05K1/02;H05K3/22;H05K3/00 主分类号 H05K1/02
代理机构 代理人
主权项 1. A layered body with a support substrate, the layered body being on the support substrate and comprising: metal foil B arranged on the support substrate; an insulating layer B arranged on the metal foil B; metal foil C arranged on the insulating layer B; a non-through hole for a product and non-through holes for an alignment mark that penetrate the metal foil C and the insulating layer B and reach the metal foil B; and the alignment mark of a dot pattern in which the non-through holes for the alignment mark are filled by plating and gathered and arranged in an individually independent state.
地址 Tokyo JP