发明名称 |
LAYERED BODY WITH SUPPORT SUBSTRATE, METHOD FOR FABRICATING SAME, AND METHOD FOR FABRICATING MULTI-LAYER WIRING SUBSTRATE |
摘要 |
A layered body with a support substrate, the layered body being on the support substrate and comprising: metal foil B which is arranged on the support substrate and on which a wiring pattern is not formed; an insulating layer B which is arranged on the metal foil B; metal foil C which is arranged on the insulating layer B and on which a wiring pattern is not formed; non-through holes for a product and non-through holes for an alignment mark that penetrate the metal foil C and the insulating layer B and reach the metal foil B; and the alignment mark of a dot pattern in which the non-through holes for the alignment mark are filled by plating and gathered and arranged in an individually independent state. |
申请公布号 |
US2016198564(A1) |
申请公布日期 |
2016.07.07 |
申请号 |
US201314655472 |
申请日期 |
2013.12.27 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
HATAZAWA Hiroki |
分类号 |
H05K1/02;H05K3/22;H05K3/00 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A layered body with a support substrate, the layered body being on the support substrate and comprising:
metal foil B arranged on the support substrate; an insulating layer B arranged on the metal foil B; metal foil C arranged on the insulating layer B; a non-through hole for a product and non-through holes for an alignment mark that penetrate the metal foil C and the insulating layer B and reach the metal foil B; and the alignment mark of a dot pattern in which the non-through holes for the alignment mark are filled by plating and gathered and arranged in an individually independent state. |
地址 |
Tokyo JP |