| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor device, which prevents adjacent semiconductor chips from being connected to each other by a resin, in which warpages are not generated on a wiring board and whose reliability is enhanced in the manufacture of the semiconductor device of a multichip type, in which the resin is filled into gaps between the substrate and a plurality of semiconductor chips after the plurality of semiconductor chips are mounted on the wiring board. SOLUTION: Wetting and spreading preventing means of a filing resin 7, which is composed of, e.g. U-shaped grooves 10 is formed on the surface outside the mounting region of a wiring board 3, on which a plurality of semiconductor chips 1 are mounted so as to be adjacent. Thereby, when the resin 7 is filled into gaps between the board 3 and the semiconductor chips 1, the connection part of the filling resin can be prevented from being formed between the adjacent semiconductor chips 1. As the wetting and spreading prevention means of the filling resin, convex protrusion parts, resin-layer patterns or the like whose hard-to-wet contact angle is large with respect to the filling resin may be formed rather than the grooves.</p> |
