发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an excellent semiconductor device capable of suitably radiating heat generated in a semiconductor element, in a semiconductor device mounting a semiconductor element such as an LED, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device comprises: a supporting substrate 11; an insulating layer 13 formed on the supporting substrate and formed of boron nitride; and a semiconductor element 30 arranged on the insulating layer. The insulating layer has: a lower insulating layer formed on the supporting substrate and formed of amorphous boron nitride not containing boron nitride grains with a hexagonal structure; and an upper insulating layer formed on the lower insulating layer and that contains boron nitride grains with a hexagonal structure.SELECTED DRAWING: Figure 2
申请公布号 JP2016111124(A) 申请公布日期 2016.06.20
申请号 JP20140245825 申请日期 2014.12.04
申请人 STANLEY ELECTRIC CO LTD 发明人 TANAKA KAZUFUMI
分类号 H01L33/64;C23C14/06;C23C14/34;H01L23/12 主分类号 H01L33/64
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