Packaged integrated circuits having high-Q inductors therein and methods of forming same

摘要

A packaged integrated circuit includes an integrated circuit substrate and a cap bonded to a surface of the integrated circuit substrate. The cap has a recess therein that is at least partially lined with at least one segment of an inductor. This inductor may be electrically coupled to an electrical component within the integrated circuit substrate. In some embodiments, the inductor is patterned to extend along a sidewall and interior top surface of the recess, which extends opposite the integrated circuit substrate. The inductor may include a plurality of arcuate-shaped segments and may be patterned to be symmetric about a center-tapped portion thereof. The cap may also include a magnetic material therein that increases an effective inductance of the inductor relative to an otherwise equivalent cap and inductor combination that is devoid of the magnetic material.

主权项

1. A packaged integrated circuit, comprising:
an integrated circuit substrate; and a packaging cap bonded to an upper surface of said integrated circuit substrate, said packaging cap having a recess therein that at least partially defines an interior of a sealed cavity extending between said packaging cap and the upper surface of said integrated circuit substrate and is at least partially lined with at least one segment of an inductor, which is exposed to the sealed cavity; wherein said packaging cap comprises a magnetic material therein that increases an effective inductance of the inductor relative to an otherwise equivalent packaging cap and inductor combination that is devoid of the magnetic material; wherein the inductor and the magnetic material are electrically disconnected from each other; and wherein the sealed cavity extends between the magnetic material and the upper surface of said integrated circuit substrate.