| 摘要 |
PURPOSE:To obtain a worked face of high quality by backing off a substrate from a polishing plate face after a specified polishing operation, supplying water to this polishing plate face to reduce the density of a polishing fluid remained on the polishing plate face, and bring the substrate again into contact with the polishing plate face so as to dress the substrate by water. CONSTITUTION:A substrate 1 (for example, a semiconductor substrate) is brought into contact with a face of a polishing cloth 5 while supplying a polishing fluid from a tank 13, and the substrate 1 is polished by the relative motion of the cloth relative to the substrate. Then, after raising a post 7 and a arm 4 by a lifting device 9 and backing off the substrate 1 from the face of the polishing cloth 5, the supply of the polishing fluid from the tank 13 is stopped, water is supplied from a tank 14 to the face of the polishing cloth 5, and the density of the polishing fluid is reduced until it fails to polish the substrate 1. After this, the substrate 1 is lowered again and brought into contact with the face of the polishing cloth 5, and in this state the substrate 1 is dressed with high accuracy while supplying water from the tank 14. |
