| 摘要 |
A process of manufacturing thin monolithic multilayer capacitors having improved resistance to delamination. Basically, the process comprises the steps of providing a support sheet having registration indicia, such as a series of registration holes along the support edges, casting a substrate of ceramic particles in a resin binder onto the support, drying the substrate, forming thin electrodes in selected patterns by cathode sputtering, casting an additional substrate on the electrode surface in a vacuum, repeating the drying, electrode formation steps a selected number of times and forming a cover layer of substrate material over the final electrode. Individual capacitors may be cut from the multilayer product in any desired shape using any desired cutting technique. Ordinarily, the electrodes are formed in two alternating patterns in registration on succeeding layers. This process produces thinner multilayer capacitors with improved bonding between succeeding layers so as to increase resistance to delamination during cutting and use.
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