| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a material which is inexpensively and normally used as an electrode material of an emitter of a field emission plate display device instead of niobium and is excellent in an adhesive property to an IC and mutual connection. SOLUTION: In arrangement of a sub-layer, titanium-tungsten Ti:W and aluminum are used as the metallization material for a gate electrode 60, a bonding pad 80, lead interconnections 100 and 120 and an integrated circuit IC mounting pad 90 on an emitter plate 10 of a field emission display. In a disclosed embodiment, the metallization material is imparted by combining the sub-layer of titanium-tungusten and aluminum with niobium.</p> |
