发明名称 ELECTRONIC-COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic-component mounting apparatus, by which a situation that chips housed in a bulk-type parts feeder becomes out of shock can be predicted on the side of a machine body. SOLUTION: A bulk-type parts feeder 20 is formed in such a way that a case 22 in which chips P are housed at random is mounted on a body 21. The chips P which are sent out in a row to a tunnel inside the body 21 from the case 22 are sucked out to a picking-up position, due to a negative pressure generated by a negative-pressure generator inside the body 21, and they are picked up by a nozzle 6 at a transfer head 5. A situation that the chips P at the parts feeder 20 becomes out of stock is detected by a sensor 40 installed at the inside of the body 21. Then, a control part 41 turns on a light-emitting element 42 which is installed on the surface of the body 21, a sensor 8 on the side of a machine body detected its light, and the side of the machine body predicts that the chips become out of stock soon.
申请公布号 JPH10163698(A) 申请公布日期 1998.06.19
申请号 JP19960321232 申请日期 1996.12.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TANAKA YUJI
分类号 B23P19/00;H05K13/02;H05K13/08 主分类号 B23P19/00
代理机构 代理人
主权项
地址