METHOD FOR THE PRODUCTION OF AN ELECTRONIC COMPONENT

摘要

The aim of the invention is the simplification and improvement of the method of production of electronic components with a circuit arrangement applied to a support body and with through contacts arranged in the support body. Said aim is achieved, whereby, after application of a first metallised layer to the support body and in the through holes in the support body, provided for forming the through contacts, forming the base metallisation, the through contacts are sealed with a high viscosity serigraphic material. A low viscosity passivation layer, applied to the whole of the upper surface and the lower surface of the support body is selectively removed from particular regions of the upper surface and, on the first metallised layer thus exposed, a second metallisation layer, forming the final metallisation is applied in a low-melting material. The electrical components of the circuit arrangement are applied to the upper surface of the support body and contacted by means of a soldering process. The invention further relates to a method for sealing electrical and thermal paths in circuit boards comprising electronic components.