发明名称 WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board which can improve the transmission efficiency of signals in fine pitch or high frequency signals, by controlling characteristic impedance at a connection point of a read wiring and a write wiring of a suspension substrate equipped with circuits and a terminal of the wiring circuit board which is connected with the read and write wirings with a simple constitution. SOLUTION: In a base insulating layer 18 of the wiring circuit board 1, a suspension substrate side connection terminal 11 is formed which is provided with a first terminal 13 to be connected with read wiring 6R for reading of a suspension substrate 3 with circuit and a second terminal 14 to be connected with write wiring 6W for writing of the substrate 3. On the other surface opposite to one surface on which the suspension substrate side connection terminal is formed, a conducting plate 25 is so stuck that an aperture 27 faces a part corresponding to either the first terminal 13 and the second terminal 14. A reinforcing plate 24 is stuck on the conducting plate 25 through an adhesive layer 28. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004363205(A) 申请公布日期 2004.12.24
申请号 JP20030157478 申请日期 2003.06.03
申请人 NITTO DENKO CORP 发明人 WAKAGI SHUICHI;OKAWA TADAO;OWAKI YASUHITO
分类号 H05K1/02;G11B5/48;H05K1/05;H05K1/14;H05K3/00;H05K3/36;(IPC1-7):H05K1/14 主分类号 H05K1/02
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