PACKAGE MANUFACTURING METHOD FOR LIGHT EMITTING DIODE USING MOLD

摘要

A method for manufacturing a package of a light emitting diode is provided to obtain proper brightness angular distribution by forming a reflective surface in a desired round using a molding. A slurry including ceramic powder, a binder and a solvent is prepared(S10), and then the slurry is molded in a green sheet of a constant thickness(S13). The green sheet is cut in a predetermined size(S15). The cut green sheet is punched to form holes, and then the green sheets are laminated to form a reflective preform(S17). A conductive pattern is printed on the other surface of the green sheet to form a base layer(S18). The reflective preform is inserted into a molding and pressed to form a reflective layer(S17a), and then the reflective surface is coated with a metal material(S17b). The base layer is disposed on one surface of the reflective layer, and then is pressed to form a bonding layer(S21). The bonding layer is sintered(S25), and then is inserted between the base layer and the other surface of the reflective layer(S19).