| 摘要 |
PROBLEM TO BE SOLVED: To reduce damage to a substrate and such by using plasma when processing a substrate and reduce a substrate processing temperature.SOLUTION: The substrate processing apparatus includes: a reaction tube, accommodating a substrate holding tool for loading and holding a plurality of substrates and a heat insulation part installed under the substrate holding tool, having inside a processing chamber for processing the substrates; a buffer chamber for generating plasma in the reaction tube; and a protective tube, having a rod-shaped electrode inside, erected along a loading direction of the substrate in the buffer chamber. The protective tube is installed in the buffer chamber by penetrating the reaction tube, and is provided outside of the reaction tube at a height position of the insulation part in the reaction tube.SELECTED DRAWING: Figure 3 |
