| 发明名称 | Method for manufacturing array substrate and method for forming through hole | ||
| 摘要 | A method for manufacturing an array substrate and a method for forming a through hole are provided. The method for manufacturing the array substrate comprise: coating photoresist in an insulating layer through-hole region on a substrate; depositing an insulating layer on the substrate provided with the photoresist in the insulating layer through-hole region; and stripping off the photoresist in the insulating layer through-hole region to form an insulating layer through hole. The manufacturing method simplifies the process of forming the insulating layer through hole. | ||
| 申请公布号 | US9379146(B2) | 申请公布日期 | 2016.06.28 |
| 申请号 | US201414429247 | 申请日期 | 2014.07.18 |
| 申请人 | BOE Technology Group Co., Ltd. | 发明人 | Zhang Li;Yan Liangchen;Liu Fengjuan |
| 分类号 | H01L21/768;H01L21/283;H01L27/12;H01L29/417;H01L29/423;H01L29/66 | 主分类号 | H01L21/768 |
| 代理机构 | Banner & Witcoff, Ltd. | 代理人 | Banner & Witcoff, Ltd. |
| 主权项 | 1. A method for forming a through hole, comprising: coating photoresist on a substrate, and forming the photoresist into a photoresist portion in an insulating layer through-hole region; depositing an insulating layer on the substrate provided with the photoresist portion in the insulating layer through-hole region; and stripping off the photoresist portion in the insulating layer through-hole region to form an insulating layer through hole. | ||
| 地址 | Beijing CN | ||