| 发明名称 | Light emitting device and method for manufacturing the same including a light-reflective resin | ||
| 摘要 | A light emitting device includes a substrate, a light-emitting diode chip mounted on the substrate, a Zener diode chip mounted next to the light-emitting diode chip on the substrate, a frame-like dam material formed on the substrate to surround the light-emitting diode chip and the Zener diode chip, and a light-reflective resin injected inside the dam material to coat side surfaces of the light-emitting diode chip and side surfaces and an upper surface of the Zener diode chip. A part of the frame-like dam material swells outward to surround three of the side surfaces of the Zener diode chip. | ||
| 申请公布号 | US9379094(B2) | 申请公布日期 | 2016.06.28 |
| 申请号 | US201514616568 | 申请日期 | 2015.02.06 |
| 申请人 | TOYODA GOSEI CO., LTD. | 发明人 | Wada Satoshi;Fukui Kosei;Nonogawa Takashi |
| 分类号 | H01L25/16;H01L29/866;H01L33/50;H01L33/54;H01L33/60;H01L33/46;H01L25/075;H05B33/08;H01L33/56 | 主分类号 | H01L25/16 |
| 代理机构 | McGinn IP Law Group PLLC | 代理人 | McGinn IP Law Group PLLC |
| 主权项 | 1. A light emitting device comprising: a substrate; a light-emitting diode chip mounted on the substrate; a Zener diode chip mounted next to the light-emitting diode chip on the substrate; a frame-like dam material formed on the substrate to surround the light-emitting diode chip and the Zener diode chip; and a light-reflective resin injected inside the dam material to coat side surfaces of the light-emitting diode chip and side surfaces and an upper surface of the Zener diode chip, wherein a part of a first side of a plurality of sides of the frame-like dam material swells outward to surround three of the side surfaces of the Zener diode chip. | ||
| 地址 | Kiyosu-shi, Aichi-ken JP | ||