Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects

摘要

An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die.

主权项

1. An apparatus, comprising:
a substrate; a first bond via array with first wire bond wires (“first wires”) each of a first length extending from a first surface of the substrate; an array of bump interconnects disposed on the first surface of the substrate; a die interconnected to the substrate via the array of bump interconnects coupled to a first surface of the die; and a second bond via array with second wire bond wires (“second wires”) each of a second length different than the first length extending from a second surface of the die opposite the first surface of the die.