| 主权项 |
1. An epoxy resin composition comprising:
an epoxy compound represented by the following Formula 1; a curing agent comprising diaminodiphenyl sulfone; and an inorganic filler, wherein the inorganic filler comprises spherical alumina (Al2O3): wherein each of R1 to R14 is independently selected from the group consisting of H, Cl, Br, F, a C1-C3 alkyl, a C2-C3 alkene, and a C2-C3 alkyne, and each of m and n is 1, 2 or 3, wherein the spherical alumina includes at least three spherical alumina groups classified according to a particle size, a first spherical alumina group having an average particle diameter of 0.3 μm to 1.0 μm, a second spherical alumina group having an average particle diameter of 3.0 μm to 10.0 μm, and a third spherical alumina group having an average particle diameter of 15.0 μm to 50.0 μm, and wherein the first spherical alumina group is included at a content of 5% to 40% by weight, based on a total weight of the epoxy resin composition, the second spherical alumina group is included at a content of 5% to 40% by weight, based on a total weight of the epoxy resin composition, and the third spherical alumina group is included at a content of 30% to 80% by weight, based on a total weight of the epoxy resin composition. |
