| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composition for photosensitive dielectric with little thermal loss and capable of forming in an accurate size a dielectric layer with a high dielectric constant. which can be baked at low temperatures, as well as a dielectric formed from the composition, and an electronic component. <P>SOLUTION: The composition for forming the photosensitive dielectric contains inorganic particles consisting of (A-I) inorganic ultra-fine particles with an average particle size of less than 0.05 μm and (A-II) inorganic fine particles with an average particle size of 0.05 μm or more, (B) an alkaline fusible resin, (C) a compound containing ethylenically unsaturated group, (D) a photo polymerization initiator. <P>COPYRIGHT: (C)2004,JPO |
