| 摘要 |
PROBLEM TO BE SOLVED: To provide a porcelain composition baked at low temperature which is especially suitable for insulation substrate for wiring board which is able to be baked at low temperature, without warpage on surface of the insulating substrate even in simultaneous baking with metallized wiring layer of a high thermal expansion coefficient, and also provide a porcelain baked at low temperature, and a wiring board using the porcelain as insulating substrate. SOLUTION: The composition contains Si of 40-70 wt.% in terms of SiO2, Ba of 15-40 wt.% in terms of BaO, B of 1-5 wt.% in terms of Ba2O3, Al of 1-8 wt.% in terms of Al2O3, and rare earth element(RE) from more than 0 wt.% to 5 wt.% or less in terms of RE2O23. The porcelain composition baked at a low temperature, containing a quartz crystal at the ratio of 30 wt.% or more in the composition, is used for the insulating substrate 1 of the wiring board A. |
