| 发明名称 |
SUBSTRATE PLACING MECHANISM, SUBSTRATE PROCESSING APPARATUS, METHOD FOR SUPPRESSING FILM DEPOSITION ON SUBSTRATE PLACING MECHANISM, AND STORAGE MEDIUM |
| 摘要 |
<p>Provided is a substrate placing mechanism whereupon a substrate to be processed is placed. The substrate placing mechanism is provided with a heater plate (21), which has a surface (21a) whereupon a substrate (W) to be processed is placed and has a heating body (21b) embedded therein for heating the substrate to a film forming temperature where a film is deposited. The substrate placing mechanism is also provided with a temperature adjustment jacket (22), which is formed to cover at least a surface of the heater plate (21) other than the surface of the substrate placing surface (21a) and adjusts the temperature to be a non film forming temperature below the film forming temperature.</p> |
| 申请公布号 |
WO2009034893(A1) |
申请公布日期 |
2009.03.19 |
| 申请号 |
WO2008JP65874 |
申请日期 |
2008.09.03 |
| 申请人 |
TOKYO ELECTRON LIMITED;HARA, MASAMICHI;GOMI, ATSUSHI;MAEKAWA, SHINJI;TAGA, SATOSHI;YAMAMOTO, KAORU |
发明人 |
HARA, MASAMICHI;GOMI, ATSUSHI;MAEKAWA, SHINJI;TAGA, SATOSHI;YAMAMOTO, KAORU |
| 分类号 |
H01L21/02;C23C16/458;C23C16/46;H01L21/205 |
主分类号 |
H01L21/02 |
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