发明名称 |
SUBSTRATE WITH SILICON CARBIDE FILM, METHOD FOR PRODUCING SUBSTRATE WITH SILICON CARBIDE FILM, AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide: a high quality substrate with a silicon carbide film stacked on a Si substrate and including a 3C-SiC film; a method for manufacturing a substrate with a silicon carbide film, capable of manufacturing the substrate with a silicon carbide film; and a semiconductor device including the substrate with a silicon carbide film.SOLUTION: A substrate with a silicon carbide film of the present invention includes: a Si substrate 2; and a cubic silicon carbide film 3 and a mask 4 stacked on the Si substrate 2. The SiC film 3 has a first SiC film 31 provided on the upper side of the Si substrate 2 and a second SiC film 32 provided on the upper side of the first SiC film 31. The mask 4 has: a first mask 41 provided on the upper side of the Si substrate 2 and including an opening (first opening) 45; and a second mask 42 provided on the first SiC film 31 and including an opening (second opening) 46. The width W1 [μm] of the first opening 45 and the thickness T1 [μm] of the first mask 41 satisfy the relationship of T1<tan(54.6°)×W1.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016092399(A) |
申请公布日期 |
2016.05.23 |
申请号 |
JP20150147473 |
申请日期 |
2015.07.27 |
申请人 |
SEIKO EPSON CORP |
发明人 |
WATANABE YUKIMUNE |
分类号 |
H01L21/205;C30B29/36;H01L21/20 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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