发明名称 HEAT SINK REMOVAL DEVICE AND HEAT SINK REMOVAL METHOD
摘要 PROBLEM TO BE SOLVED: To provide a heat sink removal device which enables easy removal of a heat sink.SOLUTION: A heat sink removal device includes: a heater which heats an external heat conduction member having an adhesive force, which is reduced by heating, and configured to conduct heat between an external cooling object and an external heat sink until a temperature of the heat conduction member becomes a temperature at which the adhesive force of the heat conduction member is reduced; and a contact for energizing the heater only when the heat sink is removed.SELECTED DRAWING: Figure 1
申请公布号 JP2016152291(A) 申请公布日期 2016.08.22
申请号 JP20150028454 申请日期 2015.02.17
申请人 NEC PLATFORMS LTD 发明人 SAGAWA SHOJI
分类号 H05K7/20;H01L23/40 主分类号 H05K7/20
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