发明名称 Method and apparatus for testing a semiconductor package having a package on package (PoP) design
摘要 Embodiments include a testing arrangement for testing a first package, the testing arrangement comprising a frame having a top section and a bottom section, wherein the bottom section of the frame comprises a pickup section, and wherein the pickup section has a first air pathway; a second package mounted on a top surface of the bottom section of the frame such that a second air pathway is defined between (i) the second package and (ii) the top surface of the bottom section of the frame; and a vacuum path defined by (i) the first air pathway and (ii) the second air pathway, wherein during testing of the first package, a vacuum in the vacuum path is generated such that the pickup section of the bottom section of the frame holds the first package.
申请公布号 US9423451(B2) 申请公布日期 2016.08.23
申请号 US201414284241 申请日期 2014.05.21
申请人 Marvell World Trade Ltd. 发明人 Leung Yat Fai
分类号 G01R31/26;G01R31/28;H01L21/66 主分类号 G01R31/26
代理机构 代理人
主权项 1. A testing arrangement for testing a first package, the testing arrangement comprising: a frame having a top section and a bottom section, wherein the bottom section of the frame comprises a pickup section, and wherein the pickup section has a first air pathway; a second package mounted on a top surface of the bottom section of the frame such that (A) a second air pathway is defined between (i) the second package and (ii) the top surface of the bottom section of the frame, and(B) a third air pathway is defined between (i) a side surface and a top surface of the second package and (ii) the top section of the frame; and a vacuum path defined by (i) the first air pathway, (ii) the second air pathway, and (iii) the third air pathway, wherein the first air pathway, the second air pathway, and the third air pathway are interconnected, and wherein during testing of the first package, a vacuum in the vacuum path is generated such that the pickup section of the bottom section of the frame holds the first package.
地址 St. Michael BB